IC Advanced Packaging Equipment Market Insights and Global Outlook 2025-2031
On 2025-2-5, the latest report 【Global IC Advanced Packaging Equipment Market 2025 by Manufacturers, Regions, Types and Applications, Forecast to 2031】from Global Info Research provides a detailed and comprehensive analysis of the global IC Advanced Packaging Equipment market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2025.
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According to our (Global Info Research) latest study, the global IC Advanced Packaging Equipment market size was valued at US$ 8126 million in 2024 and is forecast to a readjusted size of USD 14560 million by 2031 with a CAGR of 8.8% during review period.
The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore"s Law", advanced packaging technology has become inevitable.
Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.
China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.
In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.
This report is a detailed and comprehensive analysis for global IC Advanced Packaging Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
IC Advanced Packaging Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type： Cutting Equipment、Solid Crystal Devices、Welding Equipment、Testing Equipment、Other
Market segment by Application：Automotive Electronics、Consumer Electronics、Other
Major players covered：ASM Pacific、Applied Material、Advantest、Kulicke&Soffa、DISCO、Tokyo Seimitsu、BESI、Hitachi、Teradyne、Hanmi、Toray Engineering、Shinkawa、COHU Semiconductor、TOWA、SUSS Microtec
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC Advanced Packaging Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IC Advanced Packaging Equipment, with price, sales quantity, revenue, and global market share of IC Advanced Packaging Equipment from 2020 to 2025.
Chapter 3, the IC Advanced Packaging Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC Advanced Packaging Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment IC Advanced Packaging Equipment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the IC Advanced Packaging Equipment sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and IC Advanced Packaging Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IC Advanced Packaging Equipment.
Chapter 14 and 15, to describe IC Advanced Packaging Equipment sales channel, distributors, customers, research findings and conclusion.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IC Advanced Packaging Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
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